Rugged Memory

SMART Rugged is a portfolio of value added services to enhance the reliability of your memory products. SMART Rugged Memory is dedicated to developing the industry's most rugged, robust, and reliable memory that meets the needs of a wide variety of demanding applications found in the defense, aerospace, IIoT, telecommunications, transportation, energy, and other industries where devices are exposed to extreme temperatures and susceptible to corrosion.

Rugged Technology

The proven value add features to enhance reliability and durability.

30μin Gold Finger
30μin Gold Finger
Thermal Throttling
Industrial Temperature (-40°C to +85°C)
Wide Temperature (-40°C to +105°C)
TCG Opal 2.0
Anti-Sulfur Resistor
AES Encryption
Conformal Coating
Industrial Temp (-40~85°C)
Underfill
Pseudo-SLC
Retention Clips
Over-Provisioning
Heat Spreaders
30μin Gold Finger

30μin Gold Finger

SMART offers 30μin of gold finger plating to protect the modules from corrosion and insertion scratching to achieve higher reliability and better signal integrity.

30μin Gold Finger
Industrial Temperature (-40°C to +85°C) Wide Temperature (-40°C to +105°C)

Industrial Temperature (-40°C to +85°C)
Wide Temperature (-40°C to +105°C)

Specifically designed for harsh environments, SMART’s Rugged Memory products go through an intensive and proven proprietary test screening process to ensure the highest reliability and stability in extreme operating environments.

Industrial Temperature (-40°C to +85°C) Wide Temperature (-40°C to +105°C)
Anti-Sulfur Resistor

Anti-Sulfur Resistor

Exposure to sulfur dioxide causes a corrosive reaction when silver alloys encounter sulfur gasses or liquid. This typically decreases resistor conductivity and thus increases failure risks.

SMART uses ASRs (Anti-Sulfur Resistors) when needed for SMART- built memory products, allowing them to operate reliably in harsh sulfur - rich environments to meet the highest industrial standards.

Anti-Sulfur Resistor
Conformal Coating

Conformal Coating

As industrial devices have to survive exposure to harsh environments, conformal coating improves product ruggedness when applied on the module surface area.

It enhances product reliability and safeguards against damage from dust, high humidity, salt water air, solvents, chemicals and other harsh materials.

Conformal Coating
Underfill

Underfill

Underfill is a polymer or liquid epoxy that is applied underneath the perimeter of key components on a module to strengthen the solder joints and reinforce the product’s resistance against shock, vibratory stress, and gravitational acceleration.

Underfill
Retention Clips (SMART Patented)

Retention Clips (SMART Patented)

As industrial and ruggedized customer equipment is exposed to severe vibration situations, module retention clips can be mechanically secured to the sides of memory socket to prevent the latches from popping open.

SMART’s patented retention clips highly improve reliability due to vibration, shaking and sudden movements.

Retention Clips (SMART Patented)
Heat Spreaders

Heat Spreaders

A Heat Spreader is designed to transfer the heat and allow regulation of the Memory Module’s working temperature. SMART offers various type of finned, non-finned clip-on, screwed-on heat spreaders for different DIMM types. SMART also offers off the shelf and custom heat spreaders to meet the unique requirements.

In addition to the aforementioned various ruggedized technologies, SMART understands and values the importance of stringent process control, BOM control and lot code traceability. With strict material selection and quality control processes, SMART ensures our Rugged Memory products meet the highest standard for the most demanding industrial applications. Please contact us for more detail about the availability of SMART Rugged Memory.