
DDR4 MIP™ (Module-in-a-Package™)
DDR4
SMART's DuraMemory™ MIP, Module-in-a-Package™, is a tiny form factor memory module that combines the benefits of industry standard SODIMMs with the SMART proprietary stacking technology. About the size of a nickel, MIP occupies one-fifth the area of a SODIMM while offering higher performance with lower power. These benefits are critical for applications, such as broadcast video, mobile routing, high-end video and graphics cards and embedded computing applications where memory density in a small space is essential. MIPs contain on-package address and control signal termination, eliminating the need in DRAM-down board usage scenarios.
- Essentials
- DDR4
- MIP
- C-temp: 0˚C to 70˚C
I-temp: -40˚C to 85˚C - 256Mx16
512Mx16
1Gx8
1Gx16 - 256Mb
512Mb
1Gb
2Gb - x64
- 1.2V
- 216-Pin
- Performance
- 2GB
4GB
8GB
16GB - 2400MT/s
2666MT/s
2933MT/s
3200MT/s - PC4-19200
PC4-21300
PC4-23400
PC4-25600 - CL = 17
CL = 19
CL = 21
CL = 22
- Environmental
- Yes
- Physical
- 22.25mm
[SMART] Special DIMM Type Brochure_2023 | 05/15/2023 |
[DuraMemory] SMART DRAM for IIoT Applications | 11/18/2023 |
[DuraMemory] SMART MIP (Module-in-a-Package) Product Brief | 10/20/2023 |
[DuraMemory] SMART Industrial Memory Product Brief | 11/18/2023 |
[DuraMemory] SMART DDR4 Product Brief | 11/18/2023 |