“We use cookies to help enhance and customize your experience on our site. If you continue browsing, you agree to the use of cookies. For more details, please read our Privacy Policy.”

DDR3 MIP™ (Module-in-a-Package™) - SPT2566MP321638NE
DuraMemory™
SMART’s DuraMemory™ MIP, Module-in-a-Package™, is a tiny form factor memory module that combines the benefits of industry standard SODIMMs with the SMART proprietary stacking technology. About the size of a nickel, MIP occupies one-fifth the area of a SODIMM while offering higher performance with lower power. These benefits are critical for applications such as broadcast video, mobile routing, high-end video and graphics cards and embedded computing applications where memory density in a small space is essential. MIPs contain on-package address and control signal termination, eliminating the need in DRAM-down board usage scenarios.
Specifications
- Essentials
- DDR3
- MIP
- C-temp: 0˚C to 70˚C
I-temp: -40˚C to 85˚C - 256Mx16
- 256Mb
- x64
- 1.35V
- 216-Pin
- Performance
- 2GB
- 1866MT/s
- PC3-14900
- CL = 13
- Environmental
- Yes
- Physical
- 22.25mm
Ordering Information
Part Number | Density | Note |
---|---|---|
SPT2566MP321638NE | 2GB | I-temp (-40˚C to +85˚C) |
SP2566MP321638SE | 2GB | C-temp (0˚C to +70˚C) |
SP2566MP321638MP | 2GB | C-temp (0˚C to +70˚C) |
Download
[DuraMemory] SMART Application Overview_DRAM for Defense | 12/08/2020 |
[DuraMemory] MIP(Module-in-a-Package) Product Brief | 09/08/2020 |
[DuraMemory] DDR3 Product Brief | 09/08/2020 |