DDR3 MIP™ (Module-in-a-Package™)
DDR3
SMART’s MIP, Module-in-a-Package™, is a tiny form factor memory module that combines the benefits of industry standard SODIMMs with the SMART proprietary stacking technology. About the size of a nickel, MIP occupies one-fifth the area of a SODIMM while offering higher performance with lower power. These benefits are critical for applications such as broadcast video, mobile routing, high-end video and graphics cards and embedded computing applications where memory density in a small space is essential. MIPs contain on-package address and control signal termination, eliminating the need in DRAM-down board usage scenarios.
- Essentials
- DDR3
- MIP
- C-temp: 0˚C to 70˚C
- 256Mx16
- 256Mb
- x64
- 1.35V
- 216-Pin
- Performance
- 2GB
- 1866MT/s
- PC3-14900
- CL = 13
- Environmental
- Yes
- Physical
- 22.25mm
SMART MIP (Module-in-a-Package)_Product Brief | 08/21/2024 |
SMART DDR3_Product Brief | 07/16/2024 |