DDR3 MIP™ (Module-in-a-Package™)
SMART’s DuraMemory™ MIP, Module-in-a-Package™, is a tiny form factor memory module that combines the benefits of industry standard SODIMMs with the SMART proprietary stacking technology. About the size of a nickel, MIP occupies one-fifth the area of a SODIMM while offering higher performance with lower power. These benefits are critical for applications such as broadcast video, mobile routing, high-end video and graphics cards and embedded computing applications where memory density in a small space is essential. MIPs contain on-package address and control signal termination, eliminating the need in DRAM-down board usage scenarios.
- C-temp: 0˚C to 70˚C
I-temp: -40˚C to 85˚C
- CL = 13