BGAE540 UE | eMMC | 153-ball/100-ball

eMMC

SMART’s DuraFlash BGAE540 eMMC is a soldered-down Flash storage solution that combines NAND Flash memory, an embedded MMC (MultiMediaCard) Controller, and advanced firmware in a small BGA (Ball Grid Array) package that provides stable, yet cost effective high-density embedded storage. The BGAE540 eMMC is designed to meet the rigid requirements of the industrial, medical and networking markets.

SMART’s BGAE540 eMMC is compliant to eMMC v5.1 specifications and is available in the standard JEDEC 0.5mm pitch, 153-ball BGA package, as well 1.0mm pitch, 100-ball BGA package. The 100-ball package offers larger ball pitch and ball diameter enabling lower cost PCB designs and simplifies PCB routing with wider metal traces.

Essentials
BGAE540
pSLC (3D TLC)
eMMC v5.1
153 ball
100 ball
Performance
Up to 320MB/s
Up to 215MB/s
Up to 9.3K IOPS
Up to 2.1K IOPS
5GB
10GB
20GB
40GB
Reliability
5GB: 11 TBW
10GB: 22 TBW
20GB: 44 TBW
40GB: 88 TBW
(JEDEC Enterprise Workload)
Environmental
1500G half-sine, 0.5 msec, 1 shock along each axis, X, Y, Z in each direction
20G 80-2000Hz, 1.52mm 20-80Hz, 3 axis
I-temp: -40℃ to +85℃
-40℃ to +85℃
40℃, Operation: 90% RH, Storage: 93% RH
Physical
11.5mm (153-ball)
14mm (100-ball)
13mm (153-ball)
18mm (100-ball)
1mm (153-ball)
2.45mm (100-ball)
SP9MDGP3AMI1140GB153-ball / I-temp (-40℃ to 85℃)
SP9QDGP3AMI1140GB100-ball / I-temp (-40℃ to 85℃)
SP9MCGP3AMI1120GB153-ball / I-temp (-40℃ to 85℃)
SP9QCGP3AMI1120GB100-ball / I-temp (-40℃ to 85℃)
SP9MBGP3AMI1110GB153-ball / I-temp (-40℃ to 85℃)
SP9QBGP3AMI1110GB100-ball / I-temp (-40℃ to 85℃)
SP9MAGP3AMI115GB153-ball / I-temp (-40℃ to 85℃)
SP9QAGP3AMI115GB100-ball / I-temp (-40℃ to 85℃)