
BGAE240 | eMMC | 153-ball/100-ball
eMMC
SMART’s DuraFlash BGAE240 eMMC is an embedded memory solution that combines NAND Flash memory, an embedded MMC (MultiMediaCard) controller, and advanced firmware in a small BGA (Ball Grid Array) package that provides stable, yet cost effective high-density embedded storage.
SMART’s BGAE240 eMMC solution is available in the standard JEDEC 0.5mm pitch, 153-ball package, as well as an eMMC interposer module which has a footprint and pin-out compatible with the JEDEC Standard 1.0mm pitch, 100-ball package. The 100-ball package offers a solution with large ball pitch and ball diameter which enables lower cost PCB designs, simplifies PCB routing with wider metal traces, resulting in better thermal dissipation.
- Essentials
- BGAE240
- MLC
- eMMC v5.0
- 153 ball
100 ball
- Performance
- Up to 260MB/s
- Up to 130MB/s
- Up to 6K IOPS
- Up to 2.2K IOPS
- 8GB
16GB
32GB
- Reliability
- 8GB: 10 TBW
16GB: 24 TBW
32GB: 56 TBW
(Sequential Workload)
- Environmental
- 1500G half-sine, 0.5 msec, 1 shock along each axis, X, Y, Z in each direction
- 20G 80-2000Hz, 1.52mm 20-80Hz, 3 axis
- W-temp: -40℃ to +105℃
- -40℃ to +105℃
- 40℃, Operation: 90% RH, Storage: 93% RH
- Physical
- 11.5mm (153-ball)
14mm (100-ball) - 13mm (153-ball)
18mm (100-ball) - 1mm (153-ball)
2.45mm (100-ball)
[DuraFlash] BGAE240 eMMC_Product Brief | 05/18/2023 |
SMART DuraFlash eMMC_Case Study | 07/18/2022 |
[SMART] Flash Storage Product Brochure_2023 | 11/23/2023 |