BGAE240 | eMMC | 153-ball/100-ball

eMMC

SMART’s DuraFlash BGAE240 eMMC is an embedded memory solution that combines NAND Flash memory, an embedded MMC (MultiMediaCard) controller, and advanced firmware in a small BGA (Ball Grid Array) package that provides stable, yet cost effective high-density embedded storage.

SMART’s BGAE240 eMMC solution is available in the standard JEDEC 0.5mm pitch, 153-ball package, as well as an eMMC interposer module which has a footprint and pin-out compatible with the JEDEC Standard 1.0mm pitch, 100-ball package. The 100-ball package offers a solution with large ball pitch and ball diameter which enables lower cost PCB designs, simplifies PCB routing with wider metal traces, resulting in better thermal dissipation.