BGAE240 | eMMC | 153-ball

eMMC

SMART’s DuraFlash™ BGAE240 eMMC product family is an embedded memory solution that combines 2D-MLC NAND Flash Memory, an embedded MMC (MultiMediaCard) controller, and advanced firmware in a small BGA (Ball Grid Array) package that provides a stable, yet cost effective high-density embedded storage. SMART offers the option to pre-configure the User Partition to Enhanced Storage Media (pSLC mode) per JEDEC eMMC specification.

eMMC can simplify system design because of the widely adopted JEDEC® eMMC standard interface in host system chipsets and operating system software driver support.

SMART’s BGAE240 eMMC is compliant to eMMC v5.0 specification and standard JEDEC 0.5mm pitch, 153-ball 11.5mm x 13mm BGA package.

Specifications
Essentials
BGAE240
MLC
eMMC v5.0
153 ball
Performance
Up to 270MB/s
Up to 95MB/s
Up to 5.3K IOPS
Up to 1.2K IOPS
4GB
8GB
16GB
32GB
64GB
Reliability
N/A
Environmental
1500G half-sine, 0.5 msec, 1 shock along each axis, X, Y, Z in each direction
20G 80-2000Hz, 1.52mm 20-80Hz, 3 axis
I-temp: -40℃ to +85℃
W-temp: -40℃ to +105℃
-40℃ to +85℃
40℃, Operation: 90% RH, Storage: 93% RH
Physical
11.5mm (153 ball)
14mm (100 ball)
13mm (153 ball)
18mm (100 ball)
1mm (153 ball)
2.45mm (100 ball)
Ordering Information
Part NumberCapacityNote
SH9MCGP1ATI0164GBI-temp (-40℃ to 85℃)
SH9MBGP1BTW0132GBW-temp (-40℃ to 105℃)
SH9MBGP1ATI0132GBI-temp (-40℃ to 85℃)
SH9MAGP1BTW0116GBW-temp (-40℃ to 105℃)
SH9MAGP1ATI0116GBI-temp (-40℃ to 85℃)
SH9M8GP1BTW018GBW-temp (-40℃ to 105℃)
SH9M8GP1ATI018GBI-temp (-40℃ to 85℃)
SH9M4GP1BTW014GBW-temp (-40℃ to 105℃)
SH9M4GP1ATI014GBI-temp (-40℃ to 85℃)