BGAE240 MLC | eMMC | 153-ball/100-ball

eMMC

SMART’s DuraFlash BGAE240 eMMC is an embedded memory solution that combines NAND Flash memory, an embedded MMC (MultiMediaCard) controller, and advanced firmware in a small BGA (Ball Grid Array) package that provides stable, yet cost effective high-density embedded storage.

SMART’s BGAE240 eMMC solution is available in the standard JEDEC 0.5mm pitch, 153-ball package, as well as an eMMC interposer module which has a footprint and pin-out compatible with the JEDEC Standard 1.0mm pitch, 100-ball package. The 100-ball package offers a solution with large ball pitch and ball diameter which enables lower cost PCB designs, simplifies PCB routing with wider metal traces, resulting in better thermal dissipation.

Essentials
BGAE240
MLC
eMMC v5.0
153 ball
100 ball
Performance
Up to 260MB/s
Up to 130MB/s
Up to 6K IOPS
Up to 2.2K IOPS
8GB
16GB
32GB
Reliability
8GB: 10 TBW
16GB: 24 TBW
32GB: 56 TBW
(Sequential Workload)
Environmental
1500G half-sine, 0.5 msec, 1 shock along each axis, X, Y, Z in each direction
20G 80-2000Hz, 1.52mm 20-80Hz, 3 axis
W-temp: -40℃ to +105℃
-40℃ to +105℃
40℃, Operation: 90% RH, Storage: 93% RH
Physical
11.5mm (153-ball)
14mm (100-ball)
13mm (153-ball)
18mm (100-ball)
1mm (153-ball)
2.45mm (100-ball)
KTMBGP1CWW0132GB153-ball / W-temp (-40℃ to 105℃)
KTMAGP1CWW0116GB153-ball / W-temp (-40℃ to 105℃)
KTM8GP1CWW01 8GB153-ball / W-temp (-40℃ to 105℃)
SPQBGP1CWW0132GB100-ball / W-temp (-40℃ to 105℃)
SPQAGP1CWW0116GB100-ball / W-temp (-40℃ to 105℃)
SPQ8GP1CWW018GB100-ball / W-temp (-40℃ to 105℃)