DDR4 MIP™ (Module-in-a-Package™)

DDR4

SMART's DuraMemory™ MIP, Module-in-a-Package™, is a tiny form factor memory module that combines the benefits of industry standard SODIMMs with the SMART proprietary stacking technology. About the size of a nickel, MIP occupies one-fifth the area of a SODIMM while offering higher performance with lower power. These benefits are critical for applications, such as broadcast video, mobile routing, high-end video and graphics cards and embedded computing applications where memory density in a small space is essential. MIPs contain on-package address and control signal termination, eliminating the need in DRAM-down board usage scenarios.

Essentials
DDR4
MIP
C-temp: 0˚C to 70˚C
I-temp: -40˚C to 85˚C
256Mx16
512Mx16
1Gx8
1Gx16
2Gx16
256Mb
512Mb
1Gb
2Gb
x64
1.2V
216-Pin
Performance
2GB
4GB
8GB
16GB
2400MT/s
2666MT/s
2933MT/s
3200MT/s
PC4-19200
PC4-21300
PC4-23400
PC4-25600
CL = 17
CL = 19
CL = 21
CL = 22
Environmental
Yes
Physical
22.25mm
ST2046MP42W625MF16GBC-temp (0˚C to +70˚C)
ST2046MP42W614MB16GBC-temp (0˚C to +70˚C)
ST1026MP41W672SB8GBC-temp (0˚C to +70˚C)
ST1026MP41W693HC8GBC-temp (0˚C to +70˚C)
STT1026MP411625MF8GBI Temp (-40˚C to +85˚C)
STT5126MP451625MR4GBI Temp (-40˚C to +85˚C)
STT2566MP421625MG2GBI Temp (-40˚C to +85˚C)
STT2566MP421625NE2GBI Temp (-40˚C to +85˚C)