DuraMemory
MIP™ (Module-in-a-Package)
SMART's MIP is a tiny form factor memory module that combines the benefits of industry standard SO-DIMMs with the SMART proprietary stacking technology. About the size of a nickel, MIP occupies one-fifth the area of a SO-DIMM while offering higher performance with lower power.

Features & Benefits

  • Occupies only 1/5th the space of a SO-DIMM
  • Up to 42% power savings vs SO-DIMMs
  • Superior ruggedness – soldered down; no sockets or clips
  • Leverages SMART's proven stacking technology
  • Vtt termination completed on the MIP
  • Bypass caps on the MIP reduces noise and improves voltage stability
  • Eliminates need for extra down-board resistors and caps
  • Saves space on the PCB which is crucial in development boards. Bypass caps completed on the MIP to reduce noise and improve voltage stability

Applications

  • Medical
  • Video Broadcast
  • Video/Graphics Cards
  • Embedded Computing
  • Telecom
  • Defense/Aerospace
  • Automotive
DDR4 Modules-in-a-Package
SMART Part Number Density Height (mm) Device Config Depth xWidth Speed Voltage Temp
ST2046MP42W614SA 16GB 22.25 1Gx16 2Gb x64 2933MT/s 1.2 0°C to +70°C
ST1026MP41W672SB 8GB 22.25 1Gx8 1Gb x64 2400MT/s 1.2 0°C to +70°C
ST1026MP41W693HC 8GB 22.25 1Gx8 1Gb x64 2666MT/s 1.2 0°C to +70°C
STT5126MP451693ME 4GB 22.25 512Mx16 512Mb x64 2666MT/s 1.2 -40°C to +85°C
ST5126MP451693SC 4GB 22.25 512Mx16 512Mb x64 2666MT/s 1.2 0°C to +70°C
STT2566MP421693ND 2GB 22.25 256Mx16 256Mb x64 2666MT/s 1.2 -40°C to +85°C
DDR3 Modules-in-a-Package
SMART Part Number Density Height (mm) Device Config Depth xWidth Speed Voltage Temp
SPT2566MP321638NE 2GB 22.25 256Mx16 256Mb x64 1866MT/s 1.35 -40°C to +85°C
SP2566MP321638MP 2GB 22.25 256Mx16 256Mb x64 1866MT/s 1.35 0°C to +70°C
SP2566MP321638SE 2GB 22.25 256Mx16 256Mb x64 1866MT/s 1.35 0°C to +70°C

Key advantages of the MIP over SO-DIMMs include 42% power savings, 42% jitter reduction, and 39% PK/PK savings. These benefits are critical for applications such as broadcast video, mobile routing, high end video/graphics cards and embedded computing applications where memory density in a small space is essential.

MIPs contain on-package address and control signal termination, eliminating the need in DRAM down board usage scenarios. The MIP leverages SMART's extensive stacking technology into new markets and new applications. It addresses OEMs' need for faster memory in space-saving cube computing applications for networking, telecom and embedded markets.