DDR4 SODIMM
DDR4
SMART Modular世邁科技DuraMemory SODIMM記憶體模組有別於一般標準模組,提供較小尺寸,大小約為一般DIMM的一半。SODIMM通常使用於有空間限制的系統中,例如工業控制、嵌入式和運算系統、路由器等網通硬體等,也經常使用於嚴苛的操作環境。
SMART Modular世邁科技獨家Zefr是一套專業嚴謹的出廠前記憶體測試篩選流程,針對OEM出廠及世邁科技生產的記憶體模組,為高負載量的應用挑選出極度可靠的記憶體模組。更多資訊:https://www.smartm.com/ch/technology/Zefr
- 標準
- DDR4
- SODIMM
- C-temp: 0˚C to 70˚C
I-temp: -40˚C to 85˚C - 256Mx16
512Mx8
512Mx16
512Mx64
1Gx8
2Gx8 - 256Mb
512Mb
1Gb
2Gb
4Gb - x64
x72 - 1.2V
- 260-Pin
- 效能
- 4GB
8GB
16GB
32GB - 2666MT/s
3200MT/s - PC4-21300
PC4-25600 - CL = 19
CL = 22
- 環境
- Yes
- 尺寸
- 30.00mm
ST4096SO420825MF | 32GB | C-temp (0˚C to +70˚C) |
ST4096SO420825HD | 32GB | C-temp (0˚C to +70˚C) |
STI4096SO420825HD | 32GB | I-temp (-40℃ to +85℃) |
STI4096SO420825-HD | 32GB | I-temp (-40℃ to +85℃) |
SRI4096SO420825-SC | 32GB | I-temp (-40℃ to +85℃) |
ST2046SO410825SG | 16GB | C-temp (0˚C to +70˚C) |
ST2046SO410825MR | 16GB | C-temp (0˚C to +70˚C) |
STI2046SO410825SG | 16GB | I-temp (-40℃ to +85℃) |
STI2046SO410825-SE | 16GB | I-temp (-40℃ to +85℃) |
STI2046SO410893-SE | 16GB | I-temp (-40℃ to +85℃) |
STI2046SO410825MR | 16GB | I-temp (-40℃ to +85℃) |
ST1026SO451825SG | 8GB | C-temp (0˚C to +70˚C) |
ST1026SO410825MR | 8GB | C-temp (0˚C to +70˚C) |
ST1026SO410825SG | 8GB | C-temp (0˚C to +70˚C) |
STI1026SO410825SG | 8GB | I-temp (-40℃ to +85℃) |
STI1026SO410825MR | 8GB | I-temp (-40℃ to +85℃) |
STI1026SO410893-SE | 8GB | I-temp (-40℃ to +85℃) |
STI1026SO410825-SE | 8GB | I-temp (-40℃ to +85℃) |
ST5126SO451625MR | 4GB | C-temp (0˚C to +70˚C) |
ST5127SO451893SG | 4GB | C-temp (0˚C to +70˚C) |
SRI5126SO451625-SG | 4GB | I-temp (-40℃ to +85℃) |
STI5126SO451893SG | 4GB | I-temp (-40℃ to +85℃) |
STI5127SO451893SG | 4GB | I-temp (-40℃ to +85℃) |
ST2566SO421693SG | 2GB | C-temp (0˚C to +70˚C) |
STZ5126SO451893SG | 4GB | C-temp (0˚C to +70˚C) / Zefr |
STB5126SO451893SF | 4GB | E-temp (-25˚C to +85˚C) / Zefr |
SMART Zefr Memory for Enterprise Applications | 06/26/2024 |
SMART DRAM for IIoT Applications | 06/26/2024 |
SMART Industrial Memory_Product Brief | 07/02/2024 |
SMART DDR4_Product Brief | 08/21/2024 |