DDR4 MIP™ (Module-in-a-Package™)
DDR4
SMART Modular世邁科技DuraMemory Module-in-a-Package™ (MIP)是一款結合SODIMM標準與SMART獨家堆疊技術而研發的超小型記憶模組。MIP如同一顆鈕扣般大小，僅有SODIMM五分之一的面積，卻擁有高性能且低功耗的特色，適用於影像傳播、行動路由、高階影像卡/顯示卡、嵌入式運算等有空間限制卻又需要大容量的應用。MIP包含封裝上的位址訊號和控制訊號終端，可減少DRAM直接焊接在電路板上的必要。
- 標準
- DDR4
- MIP
- C-temp: 0˚C to 70˚C
I-temp: -40˚C to 85˚C - 256Mx16
512Mx16
1Gx8
1Gx16
2Gx16 - 256Mb
512Mb
1Gb
2Gb - x64
- 1.2V
- 216-Pin
- 效能
- 2GB
4GB
8GB
16GB - 2400MT/s
2666MT/s
2933MT/s
3200MT/s - PC4-19200
PC4-21300
PC4-23400
PC4-25600 - CL = 17
CL = 19
CL = 21
CL = 22
- 環境
- Yes
- 尺寸
- 22.25mm
| ST2046MP42W625MF | 16GB | C-temp (0˚C to +70˚C) |
| ST2046MP42W614MB | 16GB | C-temp (0˚C to +70˚C) |
| ST1026MP41W672SB | 8GB | C-temp (0˚C to +70˚C) |
| ST1026MP41W693HC | 8GB | C-temp (0˚C to +70˚C) |
| STT1026MP411625MF | 8GB | I-temp (-40℃ to 85℃) |
| STT5126MP451625MR | 4GB | I-temp (-40℃ to 85℃) |
| STT2566MP421625MG | 2GB | I-temp (-40℃ to 85℃) |
| STT2566MP421625NE | 2GB | I-temp (-40℃ to 85℃) |
| [SMART] Special DIMM Type Brochure_2024 | 12/27/2023 |
| [DuraMemory] SMART DRAM for IIoT Applications | 04/18/2024 |
| [DuraMemory] SMART MIP (Module-in-a-Package) Product Brief | 04/16/2024 |
| [DuraMemory] SMART Industrial Memory Product Brief | 04/16/2024 |
| [DuraMemory] SMART DDR4 Product Brief | 04/16/2024 |