
DDR3 MIP™ (Module-in-a-Package™) - SPT2566MP321638NE
DuraMemory™
SMART’s DuraMemory™ MIP, Module-in-a-Package™, is a tiny form factor memory module that combines the benefits of industry standard SODIMMs with the SMART proprietary stacking technology. About the size of a nickel, MIP occupies one-fifth the area of a SODIMM while offering higher performance with lower power. These benefits are critical for applications such as broadcast video, mobile routing, high-end video and graphics cards and embedded computing applications where memory density in a small space is essential. MIPs contain on-package address and control signal termination, eliminating the need in DRAM-down board usage scenarios.
Specifications
- Essentials
- DDR3
- MIP
- C-temp: 0˚C to 70˚C
I-temp: -40˚C to 85˚C - 256Mx16
- 256Mb
- x64
- 1.35V
- 216-Pin
- Performance
- 2GB
- 1866MT/s
- PC3-14900
- CL = 13
- Environmental
- Yes
- Physical
- 22.25mm
Ordering Information
Part Number | Density | Note |
---|---|---|
SP2566MP321638SE | 2GB | C-temp (0˚C to +70˚C) |
SP2566MP321638MP | 2GB | C-temp (0˚C to +70˚C) |
Download
[DuraMemory] SMART Application Overview_DRAM for Defense | 12/08/2020 |
[DuraMemory] MIP(Module-in-a-Package) Product Brief | 09/08/2020 |
[DuraMemory] DDR3 Product Brief | 09/08/2020 |