SMART’s new MIP, Module in a Package, is a tiny form factor memory module that combines the benefits of industry standard SO-DIMMs with the SMART proprietary stacking technology. About the size of a nickel, MIP occupies one-fifth the area of a SO-DIMM while offering higher performance with lower power. These benefits are critical for applications such as broadcast video, mobile routing, high-end video and graphics cards and embedded computing applications where memory density in a small space is essential. MIPs contain on-package address and control signal termination, eliminating the need in DRAM-down board usage scenarios. SMART supports all its modular memory with exemplary customer service and support.
Resources and Support
|File||Documentation||Document Size & Type||Last Updated|
|DRAM Product Line Brochure||3.2MB - PDF||4/4/2019|
|Sales Literature - DDR4 Module Product Overview||278KB - PDF||8/10/2020|
|Sales Literature - DDR3 and DDR4 MIP Product Overview||412KB - PDF||8/10/2020|
|Technical Document - DDR3 and DDR4 MIP Design Guide||619KB - PDF||8/10/2020|
|Data Sheet for PN STT2566MP421693ND||GET DATASHEET||GET DATASHEET|