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DRAM: the field for material and process innovation
With increased memory density and stringent cost reductions, DRAM manufacturers who could not innovate are forced to quit the arena.
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Taiwan Memory Company Dead on Arrival
According to Bloomberg news-agency, Taiwan lawmakers reject a public funding request after semiconductor prices and demand rebounded.
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DRAM Chip Exports Continue Booming
DRAMeXchange reports that prices continue to rise - even in the traditionally low season for DRAM chipmakers.
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Japan's Elpida to outsource chips to Taiwan's ProMOS
As it jockeys for political and technological clout in Taiwan against rival Micron, Elpida said it will outsource production of PC memory chips to Taiwan's ProMOS.
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Samsung to Raise Global DRAM Share to 45%
Representing an increase of 9 percentage points from this year's projection, Samsung aims to increase its global market share of DRAM chips to 45 percent by 2010.
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Samsung announces new .6mm-thick NAND memory package
Samsung's new NAND memory measures a mere .6mm in height, contains 32GB of storage and is 40% thinner and lighter than available memory packages.
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Analysts leery of oversupply
According to DRAMeXchange, Micron’s revenue from NAND sales rose 33.9 percent to $316 million during the third quarter of 2009.
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Micron Introduces New NAND and Low-Power DRAM Multi-Chip Packages
Micron has combined the industry's leading 34nm 4Gb SLC NAND flash memory and 50nm 2Gb LPDDR to produce its advanced NAND-LPDDR MCP combination.
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Gartner revises '09 chip forecast again
Due to improving market conditions, Gartner has again raised its 2009 semiconductor sales forecast.
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Hynix Sale Facing Tough Road Ahead
Although the chances slim that Hynix will find the right buyer late next month, creditors have agreed to sell their combined stake by open bidding process.
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