Memory Digest - February 2011

February 2011

Strategy can maximize profit in DRAM

DRAM memory pricing is at the bottom of its cycle, so now is a great time to maximize memory capacity to achieve the best performance and data throughput rates. The cost of DRAM directly impacts the type and amount of memory that system designers choose for their new product launches.

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Elpida says may raise DRAM prices in March

Elpida's president and chief executive officer, Yukio Sakamoto, told a media conference in Taipei that the company sees, for example, the price for 2-gigabyte DRAM rising up to 19 percent.

Samsung releases 1-Gbit DRAM chip with 512-pin wide I/O interface

Samsung announced the development of a 1-Gbit DRAM chip featuring a 512-pin wide I/O interface that is designed for a variety of mobile applications including smartphones and tablet PC's.

CPU, DRAM ride organic substrates at ISSCC

Papers at the International Solid State Circuits Conference described the first simple microprocessor and DRAM structures built on organic substrates.

Samsung Increases Its Already Big DRAM Market Share Lead

With Samsung’s DRAM revenue for Q4 2010 totaling $3.6 billion – they own 41.7 percent share of the entire market.

Industry proposes new mobile DRAM specs

An industry proposition for higher speed mobile DRAM technology standards could really knock some manufacturers off their game.

Spansion aims for a comeback with innovative flash memory

Chip maker Spansion is launching a new line of flash memory chips that could help them thrive in a market with larger competitors and at a time of an overall industry recovery.

Flash Demand for Tablets Will Zoom 400 Percent in 2011: Analyst

The NAND flash memory business will need to produce a huge amount more solid-state chips in 2011 to cover the mass production of some 80 new touch tablet PCs.

JEDEC releases Universal Flash Storage standard

JEDEC Solid State Technology Association has released UFS - its next-generation storage system standard for both embedded and removable flash memory-based storage in mobile devices.

MOSAID Introduces HLNAND2 Flash Memory Specification

MOSAID has announced HLNAND™2, a key step in the development of its Flash memory architecture and interface for mass storage applications.

Analyst: NAND market to 'collapse'

At the 2011 ISSCC Hynix, Samsung and Toshiba separately provided more details about their previously-announced, cutting-edge NAND parts.